Tevet Wins Editors' Choice Best Product Award For Semiconductor Manufacturing Excellence

Yoknea'm, Israel -- Tevet Process Control Technologies announced it has received the prestigious Editors' Choice Best Product Award, presented annually by Semiconductor International magazine. Tevet's development of its In-Situ Thickness Measurement System (IsTMS) won the award for its new and innovative concept for integrated metrology.

"Tevet's IsTMS is changing the face of integrated metrology," said Yuval Wasserman, CEO of Tevet Process Control Technologies. Approved for integration by leading process tool manufacturers, IsTMS has emerged as the new benchmark for speed, reliability, and cost. The IsTMS has no requirement to handle or translate the wafer, eliminating the need for deskew and pattern based training and enabling full wafer measurement times of less than two seconds.

"With the IsTMS's robust large-area optical collectors and simple yet powerful spectral detectors, capital cost is significantly reduced while maintaining MTBF at an exceptional less than 10,000 hours," said Wasserman. Tevet's broadband spectral reflectometry combined with proprietary algorithms enable the measurement of multiple thicknesses of actual device features on product wafers rather than the traditional measurement of proxy tiles or test wafers.

"Continued advances in semiconductor technology have reshaped the world, and our Editors' Choice Best Product Awards program honors those products that have made those advances possible," said Pete Singer, Editor-in-Chief of Semiconductor International. "These products embody the very best of innovations on which chipmakers rely to make their products smaller, faster, and cheaper and more reliable. We congratulate the people and the companies that have had the insight and fortitude to bring these innovative products to the market."

SOURCE: Tevet Process Control Technologies