Rudolph Unveils New MetaPULSE-III 300

Flanders, NJ -- Rudolph Technologies, Inc. announced the new MetaPULSE-III 300 that is designed specifically to meet semiconductor manufacturers' metal thin-film metrology requirements at the 45 nm technology node and beyond. The modular design of the MetaPULSE-III offers Rudolph's patented PULSE Technology. In addition, since the MetaPULSE-III is built on the new VANGUARD-II platform, it can be combined with other metrology technologies to characterize a wide range of advanced processes.

"The semiconductor industry is being presented with a particularly difficult challenge as we move below the 65 nm technology node," said Christopher Morath, Rudolph's Director of Marketing. "Increasing process complexity—in the form of advanced materials and novel device architectures—is driving a proliferation of sophisticated metrology techniques. On the other hand, as our industry continues to mature, manufacturers are under increasing pressure to reduce costs. We've considered both factors while developing the MetaPULSE-III that accommodates a wide range of capabilities with the ability to mix and match advanced metrology technologies on the same platform. This flexibility of the MetaPULSE-III will enable manufacturers to quickly solve metrology challenges as they develop new advanced processes and to create customized, cost-effective metrology systems for high-volume process control," adds Morath.

Applications of the MetaPULSE-III include measurement and characterization of metal gates, elastic modulus, ultrathin films, advanced copper barriers, copper shunt, electroplated copper, copper CMP thickness and surface profile, advanced silicides, silicon on insulator, SiGe, thermal conductivity, and low-k dielectric adhesion. During process research and development, the metrology requirements for these and other advanced applications may evolve rapidly, requiring a metrology tool with a wide range of capabilities that can quickly generate results. The MetaPULSE-III offers a solution with its modular platform; EASy expert system software capable of combining data from multiple technologies into results; and sophisticated applications support based on years of in-fab experience.

SOURCE: Rudolph Technologies, Inc.