PVD System for 0.18 Micron Production

Novellus Systems Inc.OVA physical vapor deposition (PVD) system, from Novellus Systems (San Jose, CA) is specifically designed for 0.18 micron and smaller device generations. It combines a proprietary, hollow cathode magnetron (HCM) source technology with a high productivity platform. Inova represents Novellus' first major product offering in the PVD arena since the company's acquisition of Varian Associates' Thin Film Systems business in June 1997.

Compared to other directional sputtering source techniques, the ionized high density metal HCM source is simple in design, but achieves highly directional, uniform deposition of sputtered metal films, without compromised film quality. As a result, INOVA provides the uniformity and conformality needed for demanding PVD film applications like Ti/TiN liner/barrier layers for tungsten plug and aluminum fill, as well as advanced Ta(N)/Cu barrier/seed applications for copper interconnects. Novellus Systems Inc.OVA platform was designed to deliver both manufacturing performance and technology extendibility. It incorporates the control system and software used in the Novellus Concept Two CVD platform. Novellus has already shipped several INOVA systems to customers in Korea, Japan and the United States. Volume production shipments are scheduled to commence in mid 1998.

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