Application Note: PCTF Technology Provides Cost Effective SMT Packaging Solutions For RF Components And Modules

Ceramics are often the material of choice for packaging many RF and microwave components and modules, but have a reputation for being expensive. Plastic solutions in high volume can be cheaper, but often offer less performance. The cost effective performance features, benefits, and actual applications of leadless, ceramic SMT packages for direct mount on printed circuit board are presented in this article.

© REMTEC. Based on an article first published in ‘Microwaves & RF' Magazine, March 2007.