Product/Service

The DTS-330 is an automated in-line tinning system for a wide range of components such as DIPs, SIPs, and most configurations of SOICs and PLCCs. It is also recommended for power devices such as TO-220, TO-247, etc. Special grippers are designed to handle the components in singulated form, but it is also possible to specify conveyor set-ups that will handle a wide variety of components in strips or lead frames.

The optional CF continuous feed conveyor is equipped with special grippers, with multiple titanium blades, designed to handle components continuously fed into the system, without the requirement for singulation at the input. This system is suitable for high throughput processing of a wide range of TO and SIP components, including power devices.

The system is typically used to comply with the solderability and cleaning requirements of MIL-STD 2000, MIL-PRF-19500, MIL-PRF-38534, and MIL- PRF-38535.

The system may be specified to run lead-free alloys with little or no equipment modification. To convert existing machines to lead-free requires only a change in solder module to avoid contamination.

The DTS-330LL is comprised of a central processing module and may be equipped with several input and output handling options, depending on the userís requirements. The system may be placed in-line with trim & form, inspection, or other equipment to eliminate handling.

In the standard configuration the process is as follows:
Pre-clean component
Rinse and dry
Apply flux
Radiant preheat
Solder coat leads in solder wave
Cool component to solidify solder
Wash, rinse and dry component

Corfin Automation, LLC, 7 B Raymond Avenue, Unit One, Salem, NH 03079. Tel: 603-893-5100; Fax: 603-893-9033.

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