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10.03.11 -- 3M And IBM Develop New Types Of Adhesives To Create 3-D Semiconductors

October 3, 2011

Industry News
	3M And IBM Develop New Types Of Adhesives To Create 3-D Semiconductors
	Accel-RF Collaborates With Leading Universities On GaN Semiconductor Research
	Acacia Subsidiary Acquires Over 50 Patents For Semiconductor Manufacturing Processing
	Altair Chipsets Selected By Harris For Use In LTE Terminal Product Line
	Cole-Parmer Introduces Masterflex® C-Flex® ULTRA Tubing
	Rudolph Delivers Run-To-Run Process Control To Bosch Automotive
	Freescale Expands Enablement Portfolio For Healthcare Applications
	Applied Materials Clears Critical Roadblock To EUV Lithography With New Photomask Etch System
	Keithley Upgrades Semiconductor Test Software For High Throughput Wafer Production Test
	ClioSoft's HCM System Enables Moortec To Collaborate In Synopsys Custom Design Flow
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