News | April 5, 2008

Aviza Technology Receives Order For Omega fxP Etch System

Scotts Valley, CA - Aviza Technology, Inc., a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, recently announced a new order for its Omega fxP system, with two Inductively Coupled Plasma (ICP) process modules, to a key foundry based in China. The Omega fxP will be used for silicon trench and polysilicon etch-back processes in manufacturing power device products.

"Aviza is proud to announce this win as it expands the market penetration of the Omega fxP etch tools into this important region," said Kevin Crofton, Vice President and General Manager, PVD/CVD/Etch Business Unit of Aviza Technology. "Aviza's success with our Sigma fxP PVD tool already installed at this customer's facility played a role in securing this order, having firmly demonstrated first-hand Aviza's technology and process expertise as well as our commitment to our customer."

About Omega fxP

Omega fxP is a cluster system designed for high volume production that offers up to six process modules, combined with wafer alignment, cool-down and two vacuum cassette stations. The system provides high throughput for the high volume user or the option to "mix and match" different plasma sources so that advanced sequential etching processes can be addressed. Key applications for Omega include highly controlled Si trench etch plus metal and oxide etch for power devices, deep silicon etch and bulk silicon removal for MEMS and Wafer Level Packaging.

SOURCE: Aviza Technology, Inc.