SRC And MIT Extend High Resolution Lithography Capabilities With Breakthrough Block Copolymer Self-Assembly Pattern Research
MIT researchers sponsored by Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies, have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components
Cadence Licenses Tensilica ConnX BBE16 DSP To GCT Semiconductor
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that GCT Semiconductor, Inc. licensed the Cadence® Tensilica® ConnX BBE16 digital signal processing (DSP) core for a next-generation chipset targeting mobile applications
Freescale Expands Family Of Programmable Power Management ICs For Power-Constrained Connected Devices
Freescale Semiconductor recently announced the addition of the MMPF0200 device to its PF Series of highly programmable power management ICs (PMICs)
IDT Extends Market Leadership With Industry’s First WPC 1.1 And PMA 1.1 Dual-Mode Wireless Power Receiver
Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, recently announced the industry’s first dual-mode wireless power receiver compatible with both the Wireless Power Consortium’s (WPC) 1.1 Qi standard, as well as the Power Matter’s Alliance (PMA) 1.1 standard.
POET Technologies Announces Integrated Optoelectronic Infrared Device Fabrication And Industrial Foundry Validation
POET Technologies Inc. (TSX VENTURE:PTK)(OTCQX:POETF) ("the Company") - announced today the fabrication of infrared (IR) detectors, using its proprietary planar optoelectronic technology (POET) platform for monolithic fabrication of integrated electronic and optical devices on a single semiconductor wafer
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