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Flanders, NJ - Rudolph Technologies, Inc. recently announced that it has received multiple system orders for its recently-introduced AXi 940 macro defect inspection module from a major chip manufacturer based in Singapore. This order for three systems reflects the success of an evaluation for advanced photolithography and CMP applications. Two systems shipped in April, with the third scheduled for June.

"The size of the order puts us ahead of our own projections for this tool," commented Scott Balak, AXi inspection product manager, "but more significantly, it affirms the design choices we made and the value this customer recognizes in the resulting product. Clearly, the productivity, accuracy and reliability of the new tool were apparent in this evaluation, and we expect rapid adoption of the AXi 940 in these important market segments."

The new AXi 940 module, the latest addition to Rudolph's industry-leading line of macro defect inspection tools, integrates the company's most advanced operational and analytical software with a fast new frontside inspection platform. This convergence of technology delivers the best available combination of defect sensitivity and inspection throughput. A completely redesigned software interface further enhances performance and productivity by streamlining nonproductive tool management operations. For example, recipe setup now takes less than five minutes and recipes can be created offline for one module while other modules remain in production. Together, with the E25 edge inspection module and the B20 backside inspection module, the AXi 940 completes the Explorer Inspection Cluster—a multi-surface inspection system designed to deliver fast, accurate and reliable macro inspection at a low cost-of-ownership.

SOURCE: Rudolph Technologies