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Newport Beach, CA - Mindspeed Technologies, Inc., a supplier of semiconductor solutions for network infrastructure applications, recently announced that Huawei-3Com has selected Mindspeed's high-level data link control (HDLC), broadband access multiplexer (BAM) and T3/E3 line interface unit (LIU) devices for use in the company's H3C AR series routers. Huawei-3Com is a joint venture between Huawei Investment and Holding Co., Ltd. and 3Com.

"By providing Layer 1 and Layer 2 solutions with accompanying software, we are able to offer complete solutions for Huawei-3Coms channelized and unchannelized T3, T1, and OC-3 cards enabling accelerated time-to-market and reduced system costs," said Taqi Mohiuddin, director of product marketing for Mindspeed.

According to Mindspeed, their highly integrated, 1,024 multi-channel HDLC controller used in conjunction with its high-density BAM and multi-port T3/E3 LIU devices enable Huawei-3Com to develop a high-density, software configurable datacom router.

Huawei-3Com's AR series routers are oriented to enterprise users, serving as convergence layer routers in large networks or core routers in medium-sized networks. The H3C AR series routers meet all requirements for network performance, service integration, high reliability, high security and tri-play solutions for rapid information development.

SOURCE: Mindspeed Technologies, Inc.