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•Article: An In-Depth Study Of Copper Selective Resins And Activated Carbon Processes In Treating CMP Wastewaters

Major process changes have occurred in the last few years as advanced semiconductor device technology has narrowed interconnect line widths to 45 nanometers (nm). These include 300-millimeter (mm) wafer platforms and the use of copper as the interconnect conductor. Earlier interconnect technology used aluminum and tungsten conductors for multilevel metal interconnects. As a result of these advances, the semiconductor industry must now treat wastewater from various processes associated with the use of copper.

*Reprinted from the November 2006 edition of Ultrapure Water. Copyright 2006 by Tall Oaks Publishing, Inc.

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•Article: An In-Depth Study Of Copper Selective Resins And Activated Carbon Processes In Treating CMP Wastewaters

SOURCE: Siemens Industry, Inc. - Water Technologies