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4.5.10 -- Faster, Cheaper Chips From Space Technology

April 5, 2010

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Industry News
Faster, Cheaper Chips From Space Technology
New Spintronics Material Could Spur Next Microelectronics Wave
ON Semiconductor Introduces Integrated Voltage Regulator
e2v Extends Availability Of Freescale 68K-Series Microprocessors
3M And Yushin Partner On Temporary Wafer Bonding Technology To Enable 3-D Semiconductors
Class-D Audio Amplifiers Reduce Design Complexity And Enhance Sound Quality In Portable Electronics
TowerJazz Announces VectraWave's First 40G Circuit Designed Using SiGe BiCMOS Process
Mitsubishi Electric & Electronics USA To Sell TFT-LCD Modules In Americas
Jordan Valley Semiconductors Acquires Assets Of Semiconductor Equipment Supplier Metrosol
Synopsys Enables First-Pass Silicon Success On Infineon's Wireless Product
Alphion Corporation Announces 7-Pin SOA Package
Wafer-Level Camera Manufacturer Selects EV Group For Capacity Ramp
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