Business Wire

  1. Rudolph Releases New Wafer Edge And Backside Macro Inspection Modules 9/8/2008
    Rudolph Technologies, Inc., a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today the release of its new E30 and B30 modules for wafer edge and backside inspection
  2. Dellux Technologies Selects OSRAM Golden Dragon LEDs For Main Tunnel Lighting 9/8/2008
    Dellux Technologies Inc., Canada, an international leader in LED tunnel lighting, has selected Golden DRAGON® LEDs from OSRAM Opto Semiconductors for the luminaires to be installed in the “Thüringer Schmücketunnel” on the A71 in the German state Thüringen. Upon installation of the new LED luminaires, in the fall of 2008, it will be the first tunnel in Germany and the longest in Europe to be illuminated by LED light
  3. KLA-Tencor Introduces New Surfscan SP2XP Monitor-Wafer Defect Inspection System For IC Fabs 9/4/2008
    KLA-Tencor Corporation introduced the Surfscan SP2XP, a new monitor-wafer inspection system for the integrated circuit (IC) market that builds upon the success of its sister tool with the same name, introduced last year for the wafer manufacturing market
  4. SUSS MicroTec Announces 300 mm ProbeShield System Order 9/4/2008
    SUSS MicroTec Test Systems has announced that it has received an order for the PA300PS with ProbeShield® Technology, the 300 mm wafer-level probe system for device characterization and reliability test, from a major Asian semiconductor memory manufacturer
  5. X-FAB Sarawak Set To Begin Volume Production Of 0.35 Micrometer Analog/Mixed-Signal High-Voltage Technology 9/3/2008
    X-FAB Silicon Foundries, today announced that its Malaysian facility in Kuching, Sarawak, Malaysia – with its modern 200 mm production line – now is fully qualified for volume production and second sourcing of the company’s 0.35 micrometer high-voltage process technology called XH035
  6. Cymer Unveils New XLR 500d, Enabling High Productivity Dry ArF Lithography 9/3/2008
    Cymer, Inc., the market’s leading developer of light sources used to create advanced semiconductor chips, has unveiled the XLR 500d—an argon fluoride (ArF) laser light source for 32 nanometer (nm) dry lithography
  7. SiTest Solutions Standardizes On Verigy V5000e For Flash Memory Test 9/2/2008
    Verigy, a premier semiconductor test company, today announced that SiTest Solutions Ltd., a leading service provider for test engineering solutions and services, selected Verigy’s V5000 family as its flash memory test platform
  8. IAR Systems, NXP Semiconductors And Micrium Collaborate To Launch Flexible RTOS-Based Reference Design Platform 8/28/2008
    IAR Systems, NXP Semiconductors, and Micrium have announced the launch of a new reference design platform targeted at RTOS-based, ARM-powered embedded systems for industrial applications
  9. CRFS Selects XJTAG Boundary Scan To Speed Development Of RFeye Spectrum Monitoring System 8/28/2008
    CRFS (Cambridge Radio Frequency Services), a developer and manufacturer of innovative real-time spectral analysis tools, has selected the XJTAG boundary scan development system to debug, test and programme its RFeye™ real-time spectrum monitoring system
  10. Aviza Technology Receives Multiple Orders For Its Omega fxP Etch Systems For Deep Silicon Etch Applications 8/27/2008
    Aviza Technology, Inc., a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, today announced multiple orders for its 200 mm and 300 mm Omega fxP etch systems and deep silicon (DSi) etch modules to three leading semiconductor manufacturers in Europe