Business Wire

  1. Semilab Licenses Implant And Metal Thickness Metrology Technology From Applied Materials 9/17/2008
    Semilab Co. Ltd., announced today that it has licensed key patents and transferred relevant know-how from Applied Materials, Inc. The acquired intellectual property (IP) covers technology and systems used in semiconductor applications for measuring implant and metal thickness
  2. Fairchild Semiconductor's Digital Power Controllers Deliver Highly Efficient And Flexible Point-Of-Load Power Conversion Solutions 9/16/2008
    Fairchild Semiconductor addresses energy-efficiency specifications, such as Energy Star, with its first point-of-load digital power control and management products for communication and computing applications
  3. NEC Electronics And ELMOS To Enter Strategic Partnership 9/16/2008
    NEC Electronics Corporation and ELMOS Semiconductor AG are going to join forces demonstrated by entering into a worldwide long-term partnership. The agreement will encompass the joint development, cross-use of engineering and manufacturing services as well as common marketing of products for the automotive and industrial markets
  4. Achronix Semiconductor Launched To Break Through FPGA Performance Barriers 9/16/2008
    Achronix Semiconductor today announced that it has already begun shipping the world’s fastest FPGAs. The Speedster family, with the SPD60 as its initial member, delivers speeds up to 1.5 GHz, which represents a three-fold increase in performance over existing FPGAs
  5. ClariPhy Demonstrates 10G MLSD PHY In XFP Application At ECOC 2008 9/15/2008
    ClariPhy Communications, today announced that it will demonstrate its all-digital CMOS 10-Gbit/s maximum likelihood sequence detection (MLSD) technology in an XFP application at ECOC 2008, Europe’s largest conference on optical communications
  6. Rohm And Haas Unveils New ACuPLANE Copper Barrier CMP Solution 9/10/2008
    Rohm and Haas Electronic Materials, today launched its ACuPLANE™ Copper (Cu) Barrier CMP Solution for advanced Cu/low-k interconnect applications. The ACuPLANE system combines Rohm and Haas’s EcoVision 4000 CMP Pad and ACuPLANE 5000 Series slurries to deliver a tunable CMP system that meets the stringent requirements of advanced process nodes
  7. Analog Devices Selects Virage Logic's AEON Non-Volatile Memory Technology For High-Reliability Applications 9/9/2008
    Virage Logic Corporation, announced that Analog Devices, a global leader in high-performance semiconductors for signal processing applications, has licensed the company’s AEON embedded non-volatile memories (NVM) for use in a broad range of analog and mixed-signal products
  8. Microchip Technology Offers New Capacitive Touch Demo Board; Simplifies Integration Of Cap-Touch Interfaces Into 16-Bit MCUs 9/8/2008
    Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced an addition to its mTouch capacitive touch offerings, the PICDEM Touch Sense 2 Demo Board (Part # DM164128)
  9. Jazz Semiconductor Expands Analog-Intensive Mixed-Signal (AIMS) Functionality With Adoption Of Cadence Virtuoso IC 6.1 Custom Design Platform 9/8/2008
    Jazz Semiconductor, today announced availability of the Jazz IC 6.1 process design kit (PDK) for Cadence Design Systems’ Virtuoso® IC 6.1 custom design platform in Jazz’s 0.18-micron SiGe BiCMOS process (SBC18). The collaboration between Jazz and Cadence on integrated radio frequency/mixed-signal (RF/MS) platforms reduces time-to-market for AIMS products
  10. Laser Driver Chip Set Provides First Comprehensive Solution For SFP+ Transceivers 9/8/2008
    Vitesse Semiconductor Corporation, a leader in advanced ICs for Carrier and Enterprise networks, announced today the VSC7985 and VSC7986, the latest members of Vitesse’s industry leading 10 Gbps laser driver family