Failure and Yield Analysis
May 7 - 10, 2012 - Munich NM US
This course covers effective analysis tools and presents systematic process flows that simplify defect localization and characterization. By focusing on a "Do it Right the First Time" approach, the class will give you the appropriate methodology to successfully locate and characterize defects to determine the root cause of failure. The class focuses on practical application to the situations that you face daily, whether you are a manager, an engineer, or a technician working in the semiconductor field, using semiconductor components, or supplying tools to the semiconductor industry.